statement

As AI server performance improves, besides advanced-process chips, advanced packaging, high-end testing, PCB, power management and high-speed transmission are benefiting from equipment spec upgrades and demand growth; rising AI data center power use makes power infrastructure, energy management and cooling key links, and high-speed data transmission drives optical communications upgrades, showing AI opportunities spreading from the semiconductor core to peripheral industries.

A statement by 韋音如. Statements are as reported by the cited publishers — not verified by DecisionGateway.

隨著 AI 伺服器效能持續提升,除先進製程晶片,先進封裝、高階測試、印刷電路板(PCB )、電源管理及高速傳輸等領域,也持續受惠於設備規格升級與需求成長
stockintelligencenewsPublished 2026-11-10 Read source

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